University Capabilities

This Silicon Crossroads investment will create and implement an initiative to coordinate and leverage all four university labs’ capabilities, faculty, and innovation services (university resources). This initiative will build a team of dedicated university personnel to coordinate and align university resources to hub needs, technical projects and WFD projects. The investment will also supply materials and lab training required for implementation and execution. Beyond the above-mentioned hub benefits, there are additional benefits associated with the R1N for hub members. Those are as follows:

• Small Business/Non-Traditional: (1) lower risk to new material introductions, (2) quicker transition of advanced materials and performance boosters into microelectronic systems, and (3) closer engagement with universities and to workforce talent.
  
  
• Defense contractors/Large Industry: (1) exploration of wider range of technical solutions and more rapid transition to manufacturing, (2) creation of trusted and secure production, and (3) connections to graduating engineers and scientists with US citizenship.
  
  
• Universities: (1) enable faculty to better transfer knowledge to impact societal benefit, (2) inform students of career opportunities in manufacturing and hardware development, (3) provide better utilization of university facilities and capability, and (4) increase faculty discussions with industry.

University of Notre Dame

• CMOS+X, BEOL transistors, ferroelectric memory
• GaN mmwave & power, SiC, III-V, II-VI, cluster MBE, MOCVD
• Maskless lithography, atomic layer deposition, full IC capabilities
• High frequency test - amplifier & antenna radiation patterns - 4 to 220 GHz
• State-of-the-art TEM, SEM, FIB imaging suite

For more information on University of Notre Dame’s capabilities, please visit:

NDnano // University of Notre Dame

Purdue University

• State-of-the-art nanofabrication and characterization facilities at 200mm wafer scale
• CMOS+X capabilities to build on test structures from foundries
• Cleanroom and characterization training and services supported by professional staff
• Semiconductor workforce development with an emphasis on hands on training

For more information on Purdue’s capabilities, please visit:

Birck Nanotechnology Center (purdue.edu)

University of Michigan 

• CMOS+X, ferroelectric devices, next generation memories, BEOL 2D and oxide transistors
• RF & power electronics chip design and devices, including Si RFIC/THz, GaN/AlGaN, and gallium oxide
• VLSI, microsystems, and embedded systems design/fab/test for radar and electromagnetic warfare, sensing, and secure edge IoT

For more information on University of Michigan’s Capabilities, please visit:

Lurie Nanofabrication Facility (umich.edu)

University of Illinois Urbana-Champaign

• Full suite of semiconductor device fabrication tools, including 6" and 8" wafer processing
• Specialization on compound semiconductors and III-Nitrides for photonic and wide-bandgap applications
• Semi-automated tools for flip-chip and plasma-activated bonding of components to prepared substrates
• Comprehensive suite of metrology tools, including all common surface, interface and bulk probes

For more information on UIUC's capabilities, please visit:

Home | Holonyak Micro & Nanotechnology Lab | Illinois

Other University Capabilities